The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Nov. 02, 2005
Lee Teck Kheng, Singapore, SG;
Lee Teck Kheng, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
The invention includes semiconductor packages having a patterned substrate with openings extending therethrough, conductive circuit traces over the substrate and having portions extending over the openings, a semiconductor die over the circuit traces, and a matrix contacting the circuit traces and also contacting the die. The invention also includes methods of forming semiconductor packages. Such methods can include provision of a construction comprising an electrically conductive layer on a masking material. The layer has a first surface facing the masking material and a second surface in opposing relation to the first surface. The masking material is patterned to form openings extending to the first surface of the layer. The layer is then patterned. Subsequently, an integrated circuit die is provided over the second surface of the layer.