The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Apr. 25, 2005
Mitsuhiro Aizawa, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Mitsuhiro Aizawa, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific structure, is free from surface relief shapes and internal voids, and enables conduction processing simply, in a short time, at a low cost utilizing existing facilities, wherein the conduction processing of the through holes includes a step of press fitting a conductor into the through holes by a ball bonder and a step of flattening the exposed heads of the press-fit conductors by coining.