The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Dec. 19, 2002
Takeshi Miyakawa, Isezaki, JP;
Katsuhisa Ogita, Isezaki, JP;
Masafumi Hiura, Isezaki, JP;
Minoru Oda, Isezaki, JP;
Takeshi Miyakawa, Isezaki, JP;
Katsuhisa Ogita, Isezaki, JP;
Masafumi Hiura, Isezaki, JP;
Minoru Oda, Isezaki, JP;
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 10to 10Ω. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.