The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Aug. 17, 2004
Tong-hong Wang, Selangor D. E., MY;
Tong-Hong Wang, Selangor D. E., MY;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
Heat dissipation apparatus applies to a package device on a substrate. The package device has an upper surface, a bottom surface, and a sidewall between the upper and bottom surfaces, in which the bottom surface thermally contacts the substrate through multitudes of conductive bumps. For dissipating heat from the bottom surface, the heat dissipation apparatus includes a first heat-dissipating structure contacting a portion of the bottom surface and a second heat-dissipating structure on the upper surface. With the surrounding association of the first and the second heat-dissipating structures, these structures release heats from the sidewall of the die. Such a heat dissipation apparatus is capable of discharging heat at three dimensions, preventing the conductive bumps from collapsing, and enhancing reliability.