The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2007

Filed:

Dec. 03, 2002
Applicants:

Akira Fujisawa, Osaka, JP;

Daisuke Arai, Osaka, JP;

Kiyotaka Ichiki, Osaka, JP;

Yukio Sueyoshi, Osaka, JP;

Toru Yamamoto, Osaka, JP;

Tsuyoshi Otani, Osaka, JP;

Inventors:

Akira Fujisawa, Osaka, JP;

Daisuke Arai, Osaka, JP;

Kiyotaka Ichiki, Osaka, JP;

Yukio Sueyoshi, Osaka, JP;

Toru Yamamoto, Osaka, JP;

Tsuyoshi Otani, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/443 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a method of forming a thin film containing a metal oxide as the main component, the film thickness of which is relatively uniform, at a high film deposition rate over a wide area and over a long time. The present invention is a method for forming a thin film containing a metal oxide as the main component on a substrate using a mixed gas stream containing a metal chloride, an oxidizing material, and hydrogen chloride, by a thermal decomposition method at a film deposition rate of 4500 nm/min. or greater, performing at least one selected from: 1) prior to mixing the metal chloride and the oxidizing material in the mixed gas stream, contacting hydrogen chloride with at least one selected from the metal chloride and the oxidizing material, and 2) forming a buffer layer in advance on a surface of the substrate on which the thin film containing a metal oxide as the main component is to be formed.


Find Patent Forward Citations

Loading…