The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Dec. 29, 2003
Hideyo Osanai, Nagano, JP;
Susumu Ibaraki, Nagano, JP;
Ken Iyoda, Nagano, JP;
Makoto Namioka, Nagano, JP;
Hideyo Osanai, Nagano, JP;
Susumu Ibaraki, Nagano, JP;
Ken Iyoda, Nagano, JP;
Makoto Namioka, Nagano, JP;
Dowa Mining Co., Ltd., Tokyo, JP;
Abstract
There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plateis bonded to one side of a ceramic substrate, and a heat sink plate (metal base plate)is bonded to the other side thereof. On the heat sink plate, a work-hardened layeris formed by shot peening. On the metal circuit plateof the metal/ceramic bonding substrate, semiconductor chips (Si chips)are soldered (solder layer). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer) of the power module, a radiating finis mounted via a thermal greaseby means of screwsor the like.