The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Aug. 25, 2004
Majid Aghababazadeh, San Jose, CA (US);
Jose J. Estabil, Weston, CT (US);
Nader Pakdaman, Monte Sereno, CA (US);
Gary L. Steinbrueck, Wappingers, NY (US);
James S. Vickers, San Jose, CA (US);
Majid Aghababazadeh, San Jose, CA (US);
Jose J. Estabil, Weston, CT (US);
Nader Pakdaman, Monte Sereno, CA (US);
Gary L. Steinbrueck, Wappingers, NY (US);
James S. Vickers, San Jose, CA (US);
tau-Metrix, Inc., Sunnyvale, CA (US);
Abstract
The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.