The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Aug. 03, 2006
Tokichi Ito, Kyoto, JP;
Nobuaki Watanabe, Kyoto, JP;
Yoshito Oku, Kyoto, JP;
Hiroyuki Yonei, Kyoto, JP;
Tokichi Ito, Kyoto, JP;
Nobuaki Watanabe, Kyoto, JP;
Yoshito Oku, Kyoto, JP;
Hiroyuki Yonei, Kyoto, JP;
Nidec Corporation, Kyoto, JP;
Abstract
The present invention provides a method for sealing a metal housing member. A housing through hole is formed in a housing member for a lead wire sealing device. The housing member is provided with a housing through hole formed on the metal housing member and penetrates from a closed space to an open space. A resin coating layer is formed to cover a lower surface of the housing member. A metal surface exposed part is formed on a part of the resin coating layer. The circuit board having a board aperture is mounted on the metal surface exposed part via an adhesive layer while overlapping with the board aperture on the housing through hole. The lead wire is inserted in the housing through hole and the board aperture that are overlapped with each other. The sealing material is provided on the circuit board to cover the board aperture.