The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2007

Filed:

Nov. 01, 2005
Applicants:

Yong-dong Chen, Shenzhen, CN;

Guang Yu, Shenzhen, CN;

Shin-hsuu Wung, Tu-Cheng, TW;

Chun-chi Chen, Tu-Cheng, TW;

Hsieh-kun Lee, Tu-Cheng, TW;

Inventors:

Yong-Dong Chen, Shenzhen, CN;

Guang Yu, Shenzhen, CN;

Shin-Hsuu Wung, Tu-Cheng, TW;

Chun-Chi Chen, Tu-Cheng, TW;

Hsieh-Kun Lee, Tu-Cheng, TW;

Assignees:

Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Bao'an District, Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.


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