The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Nov. 08, 2005
Hsieh-kun Lee, Tu-Cheng, TW;
Chun-chi Chen, Tu-Cheng, TW;
Shin-hsuu Wung, Tu-Cheng, TW;
Yu Huang, Shenzhen, CN;
Hsieh-Kun Lee, Tu-Cheng, TW;
Chun-Chi Chen, Tu-Cheng, TW;
Shin-Hsuu Wung, Tu-Cheng, TW;
Yu Huang, Shenzhen, CN;
Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Bao'an District, Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
An electronic assembly includes a PCB (), a socket () mounted on the PCB, a CPU () connected with the socket, a heat sink () in thermal contact with the CPU, a foldable back plate () attached to an underside of the PCB and a base plane () forming four bridges (). The back plate includes a first piece section () and a second piece section () pivotally joined together by a pivot (). The first and the second piece sections each comprise two legs inserted into two corresponding bridges. Screws are used to extend through the heat sink, the PCB, the bridges to threadedly engage with the legs of the back plate, respectively. The pivot is located under a part of the PCB at which the CPU is mounted.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile