The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2007

Filed:

Mar. 20, 2006
Applicants:

Ming Yang, Shenzhen, CN;

Yeu-lih Lin, Tucheng, TW;

Chin-lung Chen, Tucheng, TW;

Inventors:

Ming Yang, Shenzhen, CN;

Yeu-Lih Lin, Tucheng, TW;

Chin-Lung Chen, Tucheng, TW;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B21D 53/92 (2006.01); F28F 1/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device () includes at least a heat pipe () and a plurality of metal fins () thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (). An extension flange () extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.


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