The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
May. 12, 2006
Tai-chun Huang, Hinchu, TW;
Chih-hsiang Yao, Taipei, TW;
Kuan-shou Chi, Taichung, TW;
Ming-ta Lei, Hsinchu, TW;
Chin-chiu Hsia, Taipei, TW;
Tai-Chun Huang, Hinchu, TW;
Chih-Hsiang Yao, Taipei, TW;
Kuan-Shou Chi, Taichung, TW;
Ming-Ta Lei, Hsinchu, TW;
Chin-Chiu Hsia, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The invention provides a bonding pad structure. At least one lower circuit layer is disposed overlying the substrate, wherein the lower circuit layer is a layout of circuit under pad. A top circuit layer is disposed overlying the lower circuit layer, wherein the top circuit layer comprises a top interconnect dielectric layer and a top interconnect pattern in the top interconnect dielectric layer. A top connecting layer is disposed overlying the top circuit layer, electrically connecting the top interconnect pattern. A top pad layer is disposed overlying the top connecting layer. A bonding ball is disposed overlying the top pad layer, wherein sides of the top interconnect pattern do not overlap a region extending inwardly and outwardly from a boundary of the bonding ball within distance of about 2.5μm.