The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Dec. 13, 2004
Applicants:
Jun Zhai, Mountain View, CA (US);
Jinsu Kwon, San Jose, CA (US);
Richard C. Blish, Ii, Saratoga, CA (US);
Inventors:
Jun Zhai, Mountain View, CA (US);
Jinsu Kwon, San Jose, CA (US);
Richard C. Blish, II, Saratoga, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/12 (2006.01); H05K 1/11 (2006.01); H01R 12/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package includes a substrate having a central axis dividing the substrate into an upper half and a lower half and an integrated circuit coupled to the substrate. A layer is provided within the substrate in the lower half thereof that is configured to resist warpage of the integrated circuit package, the layer provided a distance from the central axis.