The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Aug. 19, 2002
Luu T. Nguyen, Sunnyvale, CA (US);
Hau T. Nguyen, San Jose, CA (US);
Viraj A. Patwardhan, Sunnyvale, CA (US);
Nikhil Kelkar, San Jose, CA (US);
Shahram Mostafazadeh, San Jose, CA (US);
Luu T. Nguyen, Sunnyvale, CA (US);
Hau T. Nguyen, San Jose, CA (US);
Viraj A. Patwardhan, Sunnyvale, CA (US);
Nikhil Kelkar, San Jose, CA (US);
Shahram Mostafazadeh, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
An apparatus and method for forming a layer of underfill adhesive on an integrated circuit in wafer form is described. In one embodiment, the layer of underfill adhesive is disposed and partially cured on the active surface of the wafer. Once the underfill adhesive has partially cured, the wafer is singulated. The individual integrated circuits or die are then mounted onto a substrate such as a printed circuit board. When the solder balls of the integrated circuit are reflowed to form joints with corresponding contact pads on the substrate, the underfill adhesive reflows and is completely cured. In an alternative embodiment, the underfill adhesive is fully cured after it is disposed onto the active surface of the wafer.