The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2007

Filed:

Jan. 05, 2006
Applicants:

Darin A. Chan, San Francisco, CA (US);

Simon Siu-sing Chan, Saratoga, CA (US);

Paul L. King, Mountain View, CA (US);

Inventors:

Darin A. Chan, San Francisco, CA (US);

Simon Siu-Sing Chan, Saratoga, CA (US);

Paul L. King, Mountain View, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit is provided with a semiconductor substrate that is doped with a set concentration of an oxidizable dopant of a type that segregates to the top surface of a silicide when the semiconductor substrate is reacted to form such a silicide. A gate dielectric is on the semiconductor substrate, and a gate is on the gate dielectric. Source/drain junctions are in the semiconductor substrate. A silicide is on the source/drain junctions and dopant is segregated to the top surface of the silicide. The dopant on the top surface of the segregated dopant is oxidized to form an insulating layer of oxidized dopant above the silicide. An interlayer dielectric is above the semiconductor substrate. Contacts and connection points are in the interlayer dielectric to the insulating layer of oxidized dopant above the silicide.


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