The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7248768 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 24, 2007

Filed:

Nov. 22, 2005
Applicants:

Keum Soo Jeon, Gyeonggi-Do, KR;

Min Su Lee, Gyeonggi-Do, KR;

Sung Ho Kang, Gyeonggi-Do, KR;

Yong Wook Kim, Gyeonggi-Do, KR;

IN Su Park, Gyeonggi-Do, KR;

Inventors:

Keum Soo Jeon, Gyeonggi-Do, KR;

Min Su Lee, Gyeonggi-Do, KR;

Sung Ho Kang, Gyeonggi-Do, KR;

Yong Wook Kim, Gyeonggi-Do, KR;

In Su Park, Gyeonggi-Do, KR;

Assignee:

Doosan Corporation, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/26 (2006.01); G02B 6/42 (2006.01); G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates generally to an optical interconnection module for vertical optical coupling and a method of manufacturing the optical interconnection module. The optical interconnection module includes an optical waveguide. The optical waveguide includes substrate on which electrode pads and a predetermined circuit pattern are formed; a light source unit provided on the substrate and configured to generate an optical signal and emit the signal to an outside; an optical detection unit for receiving the optical signal from the light source unit and converting the optical signal into an electric signal; drive units provided on the substrate and configured to drive the light source unit and the light detection unit in response to electric signals supplied through the electrode pads; and a cladding layer, a core layer layered on the cladding layer, and an elliptical reflecting mirror surface placed on an end of the core layer facing the light source unit.


Find Patent Forward Citations

Jeon, Keum. (2007). Optical interconnection module and method of manufacturing the same (U.S. Patent No. 7248768). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7248768

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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