The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2007

Filed:

May. 12, 2004
Applicants:

Toshiyuki Asahi, Osaka, JP;

Yutaka Taguchi, Ibaraki, JP;

Yasuhiro Sugaya, Toyonaka, JP;

Seiichi Nakatani, Hirakata, JP;

Toshio Fujii, Neyagawa, JP;

Inventors:

Toshiyuki Asahi, Osaka, JP;

Yutaka Taguchi, Ibaraki, JP;

Yasuhiro Sugaya, Toyonaka, JP;

Seiichi Nakatani, Hirakata, JP;

Toshio Fujii, Neyagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/16 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.


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