The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2007
Filed:
Jul. 22, 2005
Applicants:
Sung-mao Wu, Kaohsiung County, TW;
Chi-tsung Chiu, Kaohsiung, TW;
Chih-pin Hung, Kaohsiung, TW;
Inventors:
Assignee:
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
An inductor and capacitor implemented with build-up vias. The inductor and capacitor comprise a conductor plane, a dielectric layer, an inductor/capacitor inducing build-up via and a conductor layer. There is a conducting material in the inductor/capacitor inducing build-up via and a fist end thereof is in contact with the conductor plane. The length of the inductor inducing build-up via is larger than one fourth of a signal wavelength while the length of the conductor inducing build-up via is smaller than one fourth of a signal wavelength.