The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2007
Filed:
Aug. 24, 2004
Dong Yeal Keum, Icheon-si, KR;
Dong Yeal Keum, Icheon-si, KR;
Dongbu Electronics, Co., Ltd., Seoul, KR;
Abstract
Methods for fabricating a copper interconnect are disclosed. A disclosed method comprises: employing a damascene process to form a first trench in a first insulating layer; depositing a first barrier layer and a first copper layer on the first insulating layer; forming a bottom copper interconnect by planarizing the first copper layer; depositing and planarizing a second barrier layer; depositing a second insulating layer; forming a via hole in the second insulating layer; employing a damascene process to form a second trench in the second insulating layer; and forming a via and an upper copper interconnect by depositing a third barrier layer and a second copper layer on the second insulating layer.