The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Nov. 25, 2003
Mukta G. Farooq, Hopewell Junction, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Frank L. Pompeo, Redding, CT (US);
Subhash L. Shinde, Cortlandt Manor, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Frank L. Pompeo, Redding, CT (US);
Subhash L. Shinde, Cortlandt Manor, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.