The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Jun. 17, 2005
Jeremy John Ralston-good, Tucson, AZ (US);
Philipp S. Spuhler, Tucson, AZ (US);
Bert M. Vermeire, Phoenix, AZ (US);
Douglas Leonard Goodman, Tucson, AZ (US);
Jeremy John Ralston-Good, Tucson, AZ (US);
Philipp S. Spuhler, Tucson, AZ (US);
Bert M. Vermeire, Phoenix, AZ (US);
Douglas Leonard Goodman, Tucson, AZ (US);
Ridgetop Group, Inc., Tucson, AZ (US);
Abstract
A die-level process monitor (DLPM) provides a means for independently determining whether an IC malfunction is a result of the design or the manufacturing processing and further for gathering data on specific process parameters. The DLPM senses parameter variations that result from manufacturing process drift and outputs a measure of the process parameter. The DLPM will typically sense the mismatch of process parameters between two or more test devices as a measure of process variation between a like pair of production devices. The DLPM may be used as a diagnostic tool to determine why an IC failed to perform within specification or to gather statistics on measured process parameters for a given foundry or process.