The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Jan. 21, 2005
Hiroaki Ohkubo, Kawasaki, JP;
Kuniko Kikuta, Kawasaki, JP;
Yasutaka Nakashiba, Kawasaki, JP;
Naoyoshi Kawahara, Kawasaki, JP;
Hiroshi Murase, Kawasaki, JP;
Naoki Oda, Tokyo, JP;
Tokuhito Sasaki, Tokyo, JP;
Nobukazu Ito, Tokyo, JP;
Hiroaki Ohkubo, Kawasaki, JP;
Kuniko Kikuta, Kawasaki, JP;
Yasutaka Nakashiba, Kawasaki, JP;
Naoyoshi Kawahara, Kawasaki, JP;
Hiroshi Murase, Kawasaki, JP;
Naoki Oda, Tokyo, JP;
Tokuhito Sasaki, Tokyo, JP;
Nobukazu Ito, Tokyo, JP;
NEC Electronics Corporation, Kawasaki, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An insulating layer is provided in such a way as to cover the multi-layer wiring layer and the pads, second vias are so formed as to reach the pads. Vanadium oxide is buried in the second vias by reactive sputtering, and a temperature monitor part of vanadium oxide is provided in such a way as to connect the second vias each other. Accordingly, the temperature monitor part is connected between the two wires.