The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Nov. 01, 2004
Guy Moshe Cohen, Mohegan Lake, NY (US);
Patricia M. Mooney, Mount Kisco, NY (US);
Vamsi K. Paruchuri, New York, NY (US);
Guy Moshe Cohen, Mohegan Lake, NY (US);
Patricia M. Mooney, Mount Kisco, NY (US);
Vamsi K. Paruchuri, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for bonding microstructures to a semiconductor substrate using attractive forces, such as, hydrophobic, van der Waals, and covalent bonding is provided. The microstructures maintain their absolute position with respect to each other and translate vertically onto a wafer surface during the bonding process. The vertical translation of the micro-slabs is also referred to herein as 'in-place bonding'. Semiconductor structures which include the attractively bonded microstructures and substrate are also disclosed.