The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Nov. 10, 2003
Pierre Liu, Hsinchu Hsien, TW;
Chen Pin Peng, Hsinchu Hsien, TW;
Pierre Liu, Hsinchu Hsien, TW;
Chen Pin Peng, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
An integrated circuit package comprises a substrate having an upper surface, a lower surface, and a long slot penetrating from the upper surface to the lower surface. The lower surface is formed with a wiring regioins arranged at side of the long slot, and the wiring regions formed with a plurality of connection points. A glue layer is coated on the upper surface of the substrate and as arranged at the periphery of the long slot. The integrated circuit has a first surface formed with a plurality of bonding pads and is adhered to the glue layer. The wires, each of which is arranged within the long slot of the substrate electrically connected the bonding pads of the integrated circuit to the connection points of the substrate. The first compound layer is filled within the long slot of the substrate to protect the wires.