The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Jul. 16, 2004
Tsung-lung Lee, Tu-chen, TW;
Zhi-gang Liu, Shenzhen, CN;
Tsung-Lung Lee, Tu-chen, TW;
Zhi-Gang Liu, Shenzhen, CN;
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, TW;
Abstract
A heat dissipation device includes a retention frame (), a heat sink () and a pair of wire clips (). The retention frame is mounted on a PCB () having an electronic component () thereon. The heat sink is surrounded in the retention frame. The heat sink includes a base () attached on the electronic component and a plurality of fins () extending from the base. The base defines holes () at opposite sides thereof along a length direction of the fins. Receiving spaces () are defined in the heat sink above the holes respectively. The clips respectively include resilient arms () received in the receiving spaces and pins () extending from the arms. The pins are received in the holes. A pair of latching portions () depends from each of the clips and are engaged with the retention frame, to thereby secure the heat sink to the electronic component.