The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Oct. 20, 2004
Yusuke Nagai, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
Satoshi Kobayashi, Tokyo, JP;
Yukio Morishige, Tokyo, JP;
Yusuke Nagai, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
Satoshi Kobayashi, Tokyo, JP;
Yukio Morishige, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.