The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Jun. 18, 2002
Akira Hosomi, Kanagawa, JP;
Naoki Kogure, Kanagawa, JP;
Kenichi Moriyama, Kanagawa, JP;
Kenichi Takahashi, Kanagawa, JP;
Atsushi Hosoda, Kanagawa, JP;
Kazuhiko Ikeda, Kanagawa, JP;
Akira Hosomi, Kanagawa, JP;
Naoki Kogure, Kanagawa, JP;
Kenichi Moriyama, Kanagawa, JP;
Kenichi Takahashi, Kanagawa, JP;
Atsushi Hosoda, Kanagawa, JP;
Kazuhiko Ikeda, Kanagawa, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.