The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
May. 18, 2004
Tsvika Kurts, Haifa, IL;
Alex Waizman, Portland, OR (US);
Marcelo Yuffe, Binyamina, IL;
Ziv Shmuely, Haifa, IL;
Tsvika Kurts, Haifa, IL;
Alex Waizman, Portland, OR (US);
Marcelo Yuffe, Binyamina, IL;
Ziv Shmuely, Haifa, IL;
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.