The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7229930 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 12, 2007

Filed:

Jan. 13, 2003
Applicants:

Alok Jain, Singapore, SG;

Phui Fah Chong, Singapore, SG;

Inventors:

Alok Jain, Singapore, SG;

Phui Fah Chong, Singapore, SG;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a low-k dielectric etching process with high etching selectivities with respect to adjacent layers of other materials, such as an overlying photoresist mask and an underlying barrier/liner layer. The process comprises the step of exposing a portion of the low-k dielectric layer to a plasma of a process gas that includes a fluorocarbon gas having a relatively low fluorine to carbon ratio, a nitrogen-containing gas, and an inert gas, wherein a volumetric flow ratio of the nitrogen-containing gas to the fluorocarbon gas is greater than about 20:1. The process can be used to over etch the low-k dielectric layer to provide improved selectivity to the photoresist mask and the barrier/liner layer, reduced striations and reduced CD loss as compared with conventional low-k dielectric etching processes.


Find Patent Forward Citations

Jain, Alok. (2007). Selective etching of low-k dielectrics (U.S. Patent No. 7229930). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7229930

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