The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2007

Filed:

Feb. 15, 2006
Applicants:

Hiroji Hanawa, Sunnyvale, CA (US);

Nils Johansson, Los Gatos, CA (US);

Boguslaw Swedek, San Jose, CA (US);

Manoocher Birang, Los Gatos, CA (US);

Inventors:

Hiroji Hanawa, Sunnyvale, CA (US);

Nils Johansson, Los Gatos, CA (US);

Boguslaw Swedek, San Jose, CA (US);

Manoocher Birang, Los Gatos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01); B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.


Find Patent Forward Citations

Hanawa, Hiroji. (2007). Monitoring a metal layer during chemical mechanical polishing (U.S. Patent No. 7229340). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7229340

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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