The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2007

Filed:

Jun. 01, 2004
Applicants:

Takanobu Hori, Hyogo, JP;

Hiroshi Kajiyama, Ibaraki, JP;

Akira Kato, Ibaraki, JP;

Inventors:

Takanobu Hori, Hyogo, JP;

Hiroshi Kajiyama, Ibaraki, JP;

Akira Kato, Ibaraki, JP;

Assignees:

Shinmaywa Industries, Ltd., Hyogo, Iakarazuka-shi, unknown;

Hitachi, Ltd., Chiyoda-ku, Tokyo, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A film deposition method and film deposition system for depositing a halogen compound film, capable of depositing such a film while suppressing abuse that occurs due to deficiency of a halogen element even if the halogen element is dissociated from a film material. The halogen compound film is deposited through a process including: evaporating a film material comprising a halogen compound by means of an evaporation source; ionizing the evaporated film material with a radio frequency power outputted from a radio frequency power supply unitand supplied through a substrate holder; and causing the ionized film material deposit on the substrate. A bias voltage outputted from a bias power supply unitand applied to the substrate holdercauses halogen ions dissociated from ions of the halogen compound to be incorporated into the film being deposited on the substrate


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