The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Mar. 29, 2002
Ping-wei Chang, San Jose, CA (US);
Brad Lee Jackson, San Diego, CA (US);
Bulent Nihat Kurdi, San Jose, CA (US);
Jennifer LU, San Jose, CA (US);
Dennis Richard Mckean, San Jose, CA (US);
Eun Kyoung Row, San Jose, CA (US);
Ping-Wei Chang, San Jose, CA (US);
Brad Lee Jackson, San Diego, CA (US);
Bulent Nihat Kurdi, San Jose, CA (US);
Jennifer Lu, San Jose, CA (US);
Dennis Richard McKean, San Jose, CA (US);
Eun Kyoung Row, San Jose, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.