The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2007

Filed:

Aug. 26, 2004
Applicants:

Naoto Ishida, Ogaki-shi, JP;

Kouji Asano, Ogaki-shi, JP;

Inventors:

Naoto Ishida, Ogaki-shi, JP;

Kouji Asano, Ogaki-shi, JP;

Assignee:

IBIDEN Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 35/12 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed wiring board has a circuit substratehaving a conductor circuitand a through holeand also has a joining pininserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party padThe joining pin is constructed by a joining head portionhaving a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portionhaving a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering materialetc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.


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