The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
May. 27, 2005
Yusuke Igarashi, Gunma, JP;
Sadamichi Takakusaki, Gunma, JP;
Hideki Mizuhara, Aichi, JP;
Ryosuke Usui, Aichi, JP;
Yusuke Igarashi, Gunma, JP;
Sadamichi Takakusaki, Gunma, JP;
Hideki Mizuhara, Aichi, JP;
Ryosuke Usui, Aichi, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A circuit device having a multilayered wiring structure and an excellent heat dissipation property, and a method of manufacturing the circuit device are provided. In a circuit device, a multilayered wiring structure including a first conductive pattern and a second conductive pattern is formed on a surface of a circuit substrate. A first insulating layer is formed entirely on the surface of the circuit substrate. The first conductive pattern and the second conductive pattern are mutually insulated by a second insulating layer. An amount and grain sizes of filler included in the second insulating layer are smaller than an amount and grain sizes of filler included in the first insulating layer. Therefore, it is easier to connect the above two conductive patterns by way of penetrating the second insulating layer.