The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7217652 B1

PDF
Full Text
Expired
Date of Patent:
May. 15, 2007

Filed:

Mar. 13, 2001
Applicant:

Wenge Yang, Fremont, CA (US);

Inventor:

Wenge Yang, Fremont, CA (US);

Assignee:

Spansion LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for making semiconductor structures uses a decoupled plasma source to produce a highly selective plasma etchant to form a structure with a thin adhesive layer and overlaying conductive layer. The preferred plasma is formed from chlorine and oxygen feed gases. The highly conductive semiconductor structure has a thickness less than about 3000 Å, preferably less than about 2600 Å, and incorporates an adhesive layer that is preferably less than about 100 Å thick. Despite the reduced profile and topography of the structure, it is more conductive than prior structures, and provides a robust device.


Find Patent Forward Citations

Yang, Wenge. (2007). Method of forming highly conductive semiconductor structures via plasma etch (U.S. Patent No. 7217652). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7217652

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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