The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Mar. 11, 2005
Shih-cheng Chang, Hsinchu, TW;
Shih-Cheng Chang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method is disclosed for completing a flip chip package design by re-using mask designs in a tool library. The method comprises analyzing one or more input/out bump locations of a chip, analyzing one or more solder ball locations of a package hosting the chip with regard to a predetermined printed circuit board, and designing the package hosting the chip by using a tool library containing one or more existing mask designs for re-use, wherein when one or more existing mask designs are used for the package, at least one custom connection layer of the package is redesigned when needed for connecting the chip to the printed circuit board without producing a full set of new masks for the package.