The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Aug. 15, 2002
Shigenobu Maruyama, Ebina, JP;
Kazumi Kawamoto, Yokohama, JP;
Hiroaki Furuichi, Yokohama, JP;
Tooru Yoshida, Yamato, JP;
Isamu Yoshida, Fujisawa, JP;
Katsuya Oono, Fujisawa, JP;
Osamu Yamada, Hiratsuka, JP;
Hiroshi Ibe, Fuchu, JP;
Shigeru Tokita, Yokohama, JP;
Tarou Tonoduka, Yokohama, JP;
Yasunori Iwafuji, Yokohama, JP;
Katsumi Kuroguchi, Yokohama, JP;
Shigenobu Maruyama, Ebina, JP;
Kazumi Kawamoto, Yokohama, JP;
Hiroaki Furuichi, Yokohama, JP;
Tooru Yoshida, Yamato, JP;
Isamu Yoshida, Fujisawa, JP;
Katsuya Oono, Fujisawa, JP;
Osamu Yamada, Hiratsuka, JP;
Hiroshi Ibe, Fuchu, JP;
Shigeru Tokita, Yokohama, JP;
Tarou Tonoduka, Yokohama, JP;
Yasunori Iwafuji, Yokohama, JP;
Katsumi Kuroguchi, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention is related to an optical communication module for transmitting high frequency signals (e.g., 10 Gbit/s and higher data rates) between an optical element and an external circuit. In an illustrative embodiment, the optical communication module includes signal transmission lines and ground lines formed on a ceramic substrate, a flexible wiring board, and a printed circuit board. The widths of the signal lines and the ground lines vary, as well as the spacing between the signal and ground lines. This facilitates characteristic impedance matching among the signal lines to within about 50Ω.