The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Jul. 29, 2004
Matthew S. Angyal, Stormville, NY (US);
Peter E. Biolsi, New Windsor, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Habib Hichri, Wappingers Falls, NY (US);
Bernd E. Kastenmeier, Austin, TX (US);
Michael W. Lane, Cortlandt Manor, NY (US);
Jeffrey R. Marino, Fishkill, NY (US);
Vincent J. Mcgahay, Poughkeepsie, NY (US);
Theodorus E. Standaert, Pine Bush, NY (US);
Matthew S. Angyal, Stormville, NY (US);
Peter E. Biolsi, New Windsor, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Habib Hichri, Wappingers Falls, NY (US);
Bernd E. Kastenmeier, Austin, TX (US);
Michael W. Lane, Cortlandt Manor, NY (US);
Jeffrey R. Marino, Fishkill, NY (US);
Vincent J. McGahay, Poughkeepsie, NY (US);
Theodorus E. Standaert, Pine Bush, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods for sealing an organic ILD layer and a metal layer after an etching step. The method includes etching through an ILD layer and leaving a remaining portion of an underlying metal layer cap, maintaining the device in an inert gas, and depositing at least a portion of a liner into the opening to seal the ILD layer and the metal layer. Subsequent processing may include formation of a via by etching through the portion of the liner and the remaining portion of the cap layer, and depositing a metal.