The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Mar. 11, 2004
Applicants:
Yam MO Wong, Singapore, SG;
Chee Wai Siew, Singapore, SG;
Wei Liu, Singapore, SG;
Zuo Cheng Shen, Singapore, SG;
Inventors:
Yam Mo Wong, Singapore, SG;
Chee Wai Siew, Singapore, SG;
Wei Liu, Singapore, SG;
Zuo Cheng Shen, Singapore, SG;
Assignee:
ASM Technology Singapore Pte Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.