The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Dec. 07, 2004
Yoshinori Miyaki, Musashimurayama, JP;
Kazunari Suzuki, Ota, JP;
Hirohito Ohashi, Fuchu, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.