The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2007

Filed:

Mar. 26, 2003
Applicants:

Jae-gab Lee, Seoul, KR;

Chang-oh Jeong, Suwon, KR;

Myung-mo Sung, Goyang, KR;

Hee-jung Yang, Namyangju, KR;

Beom-seok Cho, Seoul, KR;

Inventors:

Jae-Gab Lee, Seoul, KR;

Chang-Oh Jeong, Suwon, KR;

Myung-Mo Sung, Goyang, KR;

Hee-Jung Yang, Namyangju, KR;

Beom-Seok Cho, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a thin film transistor substrate and a metal wiring method thereof, more particularly to a thin film transistor substrate comprising self-assembled monolayers between the substrate and the metal wiring, and a metal wiring method thereof. Since a thin film transistor substrate of the present invention comprises three-dimensionally cross-linked self-assembled monolayers between the Si surface and the metal wiring, it has good adhesion ability and anti-diffusion ability.


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