The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7209366 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 24, 2007

Filed:

Mar. 19, 2004
Applicants:

Victor Prokofiev, Phoenix, AZ (US);

Cengiz A. Palanduz, Chandler, AZ (US);

Inventors:

Victor Prokofiev, Phoenix, AZ (US);

Cengiz A. Palanduz, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) package includes a chip carrier and a chip mounted to the chip carrier. The chip carrier has a centrally located power delivery region and a peripherally located input-output (I/O) delivery region disposed in partially surrounding relationship to the power delivery region. Power and ground paths are disposed in the power delivery region and I/O signal paths are disposed in the I/O delivery region.


Find Patent Forward Citations

Prokofiev, Victor. (2007). Delivery regions for power, ground and i/o signal paths in an ic package (U.S. Patent No. 7209366). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7209366

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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