The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2007

Filed:

Feb. 13, 2003
Applicants:

Mark T. Van Horn, Boise, ID (US);

Richard N. Hedden, Kuna, ID (US);

David R. Cuthbert, Meridian, ID (US);

Aaron M. Schoenfeld, Boise, ID (US);

Inventors:

Mark T. Van Horn, Boise, ID (US);

Richard N. Hedden, Kuna, ID (US);

David R. Cuthbert, Meridian, ID (US);

Aaron M. Schoenfeld, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 27/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.


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