The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Dec. 07, 2004
Emir Gurer, Scotts Valley, CA (US);
Ed C. Lee, Cupertino, CA (US);
Murthy Krishna, Sunnyvale, CA (US);
Reese Reynolds, Los Gatos, CA (US);
John Salois, Redwood City, CA (US);
Royal Cherry, San Jose, CA (US);
Emir Gurer, Scotts Valley, CA (US);
Ed C. Lee, Cupertino, CA (US);
Murthy Krishna, Sunnyvale, CA (US);
Reese Reynolds, Los Gatos, CA (US);
John Salois, Redwood City, CA (US);
Royal Cherry, San Jose, CA (US);
ASML Holdings N.V., Veldhoven, NL;
Abstract
Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold. The developer manifold and the rinse manifold can be staggered so as to reduce an external width of the nozzle compared to a nominal external width of the nozzle achievable without either intersecting the fluid manifold and the another manifold or staggering the fluid manifold and the another manifold. The systems and methods provide advantages including improve yield via reduced process-induced defect and partial counts, and improved critical dimension (CD) control capability.