The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Feb. 04, 2005
Akira Miyai, Tokyo, JP;
Yukihiko Nakajima, Tokyo, JP;
Hideki Hirotsuru, Tokyo, JP;
Ryozo Nonogaki, Tokyo, JP;
Takuya Okada, Tokyo, JP;
Masahiro Ibukiyama, Tokyo, JP;
Akira Miyai, Tokyo, JP;
Yukihiko Nakajima, Tokyo, JP;
Hideki Hirotsuru, Tokyo, JP;
Ryozo Nonogaki, Tokyo, JP;
Takuya Okada, Tokyo, JP;
Masahiro Ibukiyama, Tokyo, JP;
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.