The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Mar. 24, 2004
Hei Ming Shiu, Tsuen Wan, HK;
Kam Fai Lee, Tin Shui Wai, HK;
Ho Wang Wong, Leung King Estate, HK;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of packaging an integrated circuit die () includes the steps of providing a foil sheet () and forming a layer of solder () on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal () on it and a second, opposing side of the die includes bonding pads (). The bonding pads are electrically connected to the solder on the foil sheet with wires (). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound (). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit ().