The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Nov. 07, 2002
Narayanan Rajan, Atlanta, GA (US);
Chien Hung Wu, Parma Heights, OH (US);
Jay S. Mitchell, Atlanta, GA (US);
Lucy Huang, Solon, OH (US);
Narayanan Rajan, Atlanta, GA (US);
Chien Hung Wu, Parma Heights, OH (US);
Jay S. Mitchell, Atlanta, GA (US);
Lucy Huang, Solon, OH (US);
Movaz Networks, Inc., Norcross, GA (US);
Abstract
An array of electrostatically tiltable mirrors are formed in a MEMS structure. A first SOI wafer is etched to form an array of tiltable plates in the silicon device layer joined to the remainder of the wafer through pairs of torsion beams. A second SOI wafer is etched to form cavities corresponding to the tiltable plates. A ceramic multi-chip module (MCM) carrier is formed with multiple layers of wiring and electrodes corresponding to the tiltable plates. The two SOI wafers including their handle layers are bonded together. The handle layer of the second SOI is removed, and the bonded wafers are diced into chips. Each chip is bonded to a respective MCM carrier. Thereafter, the handle layer of the first SOI wafer is removed to release the tiltable mirror plates and the torsion beams. Electronic control chips may be bonded to the MCM carrier.