The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Sep. 03, 2004
Masazumi Matsuura, Hyogo, JP;
Hiroshi Horibe, Hyogo, JP;
Susumu Matsumoto, Osaka, JP;
Tsuyoshi Hamatani, Shiga, JP;
Masazumi Matsuura, Hyogo, JP;
Hiroshi Horibe, Hyogo, JP;
Susumu Matsumoto, Osaka, JP;
Tsuyoshi Hamatani, Shiga, JP;
Renesas Technology Corp., Tokyo, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor device includes: multiple kinds of interlayer insulating films formed on a semiconductor substrate and having different elastic moduli, respectively; a metal pad arranged on said multiple kinds of interlayer insulating films; the interlayer insulating film of a low elastic modulus having the lowest elastic modulus and having an opening located under the metal pad, the interlayer insulating film of a not-low elastic modulus having the elastic modulus larger than the elastic modulus of the interlayer insulating film of the low elastic modulus, being layered in contact with the interlayer insulating film of the low elastic modulus, and continuously extending over the opening and a region surrounding the opening and a metal interconnection layer arranged under the metal pad, filling the opening in the interlayer insulating film of the low elastic modulus, and being in contact with the interlayer insulating film of the not-low elastic modulus.