The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Sep. 23, 2003
Applicants:
Bernd Karl Appelt, Sunnyvale, CA (US);
William Tze-you Chen, Endicott, NY (US);
Inventors:
Bernd Karl Appelt, Sunnyvale, CA (US);
William Tze-You Chen, Endicott, NY (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2006.01); H01L 23/02 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.