The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Jul. 27, 2004
Applicants:
Li-fu Xu, Shenzhen, CN;
Chih-hao Yang, Tu-Chen, TW;
Ching-bai Hwang, Tu-Chen, TW;
Inventors:
Assignees:
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan () for generating airflow and a heat sink (). The heat sink has a base () and a plurality of fins (). A chamber () is defined with the fins surrounding for receiving the fan. At least one channel () is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.